We are a Sino-Swedish join-venture, established in Aug. 2004, dealing in（0201,0402,0603,SOT23,SSOP,PLCC,QFP,QFN,BGA,CSP）and more components SMT process and QFP0.4mm,BGA0.2mm soldering. Cooperating with The Sino-Swedish Center for Micro-system Integration Technology(SMIT Center), established by Chalmers University of Technology, Sweden and Shanghai University, China, we are dedicated to the technology research, training and consultation for SMT process and SMT Soldering. Now there are 31 employees, 8 engineering technical personnel, 1 doctor, 2 masters; and 5 technical personnel with over 5 years working experience in SMT industry, 70% of our employees have worked for at least 2 years in our company.

Our company now has new SMT full-auto lead-free production line (MPM2000＋MY12+HELLER1809) with about 320,000 chip components daily productivity. MPM2000 is the best full-auto Stencil Printer in the world manufactured by USA MPM Company with 0.025mm repeated precision. MY12 is a full-auto, multi-functions and high precision high speed placement machine (top 10 in the world) manufactured by Sweden MYDATA Company, which has wide supporting range including any standard component （CHIP,,QFP,PLCC,BGA, etc.）and any heterogeneous type component, uses two recognition systems of optical and machinery focusing（multi-functional placing head has focusing clip）, supporting 0.015mm precision, meeting customers’ quick-response production requirement. HELLER1809 is a N2 lead-free reflow oven of 10 temperature zones manufactured by USA HELLER Company, which is able to fine adjust temperature curves for a better soldering result. In addition, our company has semi-auto dispenser and stencil printer.
Regarding production and technical control, our engineers would solve the problem directly on-line as necessary, so our products quality could reach 50pp. Our customers involve in many industries, including semi-conductor, information technology, computer, industry control and more as well as some overseas customers. Moreover, some customers who have their own equipments will ask us to produce more difficult products.

Regarding quality control and inspection, as well as other technical support, we enjoy a strong back support from Shanghai University, and most advanced solder joint analysis equipments, such as: solder joint tensile test, solder joint weary analysis, solder section ultrasonic wave inspection, repair platforms and some clipping tools, and more. Normally, manufactures are not equipped with these equipments, while we do, because we are a searching manufacturer.