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MPM UP2000, 是一台美国生产的全自动带光学的印刷机,印刷精度±0.025。 可灵活的调整X,Y,Z等方向的偏移,刮刀的压力,速度,行程和脱模的速度和行程。可自动清洁钢网,视觉双镜头视觉对中系统,印刷PCB的速度为12s/PCB,可印刷球径为0.25mm,球间距为0.3mm的BGA,QFP可印刷到pitch为0.4mm,两脚间为0.15mm的PQFP.能做的PCB板大小为60×50mm-300×400mm。

MYDATA MY12, 是一台欧洲瑞典生产的全自动带三个相机的贴片机,重复精度达0.015mm 每小时的产能为(IPC9850为21000chip/h).能做的PCB板的大小为60×50到508×440mm,厚度为0.5-4mm.能贴装的元件大小为0201-56×56mm,厚度为15mm.元件重量为80g..带三个相机的光学定位系统和一个机械对中系统,精度达到0.015mm,能做的QFP的两脚的间距为0.15mm,BGA的球径为0.1,球间距为0.2mm.我们的特点为智能FEEDER,自动找物料,这样就能防止贴错料。并且很短的带式封装的物料也能上机贴装,如物料长的为20CM的,特别方便样板样品和研发试验的公司生产。并且机器上有自动测量电阻,电容,极性的功能,以防错料。我们的机器目前市场上的物料包装形式我们都能用。

HELLER 18HELLER1809 是美国原装进口的,有上下加上冷却共20个温区,能做无铅焊接加工,控温精度达到±1度,最高设置温度达300度,带有带式和链条两种传输方式,便于做双面板,并且带有氮气系统。

全自动线: 印刷-锡膏检测-贴片-贴片检测-回流焊接-检测-返修-点胶机。

检测: 5-100倍放大镜-返修台-超声波检测仪-拉力测试仪-疲劳测试仪。

他

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Full Automatic SMT Placement Production Line Performance(021-56338457,Welcome from Mr. Sun of Austor)

Business includes:Shanghai 0201,0402,0603,SOT23,SSOP,PLCC,QFP,QFN,BGA,CSP soldering process, Shanghai SMT process, placement process, Electric circuit board soldering, PCB board soldering, BGA soldering, energy soldering QFP0.3mm,BGA0.2mm.
MPM UP2000, is a full-auto optical print machine manufactured in USA with ±0.025 print precision.Able to flexibly adjust the offset of direction X,Y,Z, pressure, speed and route of shaving knife, as well as the speed and route of stripping. Able to auto-clean steel mesh and focusing system of visual double lens, with the speed of print PCB as 12s/PCB, printable sphere diameter as 0.25mm, BGA and QFP with 0.3mm ball spacing can be printed to PQFP with 0.3mm pitch and 0.15mm feet spacing.
MYDATA MY12, is a full-auto placement machine manufactured in Sweden with three cameras and 0.015mm redundant precision.Productivity for each hour is(IPC9850为21000chip/h). PCB board can be made from 50×50 to 508×440mm with 0.5-4mm thickness. Component replacement can be made as 0201-56×56mm with 15mm thickness. The weight of component is 80g. Optical positioning system with three cameras and machinery focusing system has as high as 0.015mm of precision, QFP has 0.15mm feet spacing, BGA has 0.1 of sphere diameter and 0.2mm of ball spacing. Our advantage is smart FEEDER, which could avoid wrong placement with its automatic material searching system. Short material of belt package also could be placed onto machine, such as the length of 20CM, which is especially convenient for the companies producing samples. In addition, the machine has resistance, electricity capacity and polarity auto-measurement functions to avoid mistake. Our machines can support material packaging types in current market.
HELLER 1809 Originally imported from USA, with 20 up and down and cooling temperature zones, support lead-free soldering process, control precision of temperature reaches ±1 degree, highest temperature reaches as high as 300 degree, support two transmission ways of belt and chain, easy for double-side board making, with nitrogen system. Full-auto Line Print-Transmission Inspection-Placement-Transmission Inspection-Reflow Soldering-Inspection-Repair-Dispenser
Inspection 5-100 times Magnifying Glass -Repair Platform-Ultrasonic Wave Inspector-Tensile Inspector-Weary Inspector

 

 

 
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